The brand new Koch-Chemie Micro Cut Hard Pad is made from high-quality specialised sponge designed to remove fine scratches, holograms, and polishing marks in collaboration with Koch-Chemie M3 Micro Cut Compound and P3 Micro Cut and Finish. The short height of 23mm creates low torsion forces whilst providing a high level of stability and excellent handling.

The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.

The colourful non-woven material, suitable for polishing, ensures process safety. Colour coordinated to match the rest of the Koch-Chemie polishing system.